MEMS Probe Card
As the core electrical interconnection carriers for chip probing, MEMS probe cards accurately transmit signals between testers and chips under test, and efficiently test electrical performance parameters of chips through a stable channel connection. They are critical components for guaranteeing wafer yield and performance verification.
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Product Advantages
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01Adapts to mainstream 12-inch wafer chip probing scenarios in the industry, with high technological maturity, and supports "one touch‑down" to significantly improve test efficiency
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02Is compatible with industry‑leading testers (e.g., T5833, Magnum5) and offers strong adaptability
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03Supports stable testing under complex working conditions such as high speed, high temperature, and high current
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04Provides 2D/3D probe configuration options to flexibly match the custom requirements of different customers
Product
Features
Corresponding Products
Covers DDR3/4/5, LPDDR3/4/5, and other memory chips
Test Performance
The basic rate is 200MHz/400Mbps, and the maximum rate is 333MHz/666Mbps; supports 3,000 DUTs/TD for parallel testing
Technical Parameters
Minimum pitch: 53μm
Card flatness: ≤30μm
Total probe quantity: 180,000 pins per wafer
Probe force: 0.8gf/1.0gf/1.2gf（@1mil）
Maximum current rating: 1.2A (@20% force drop)
Signal sharing capability: Supports ×20 and ×24 channel configurations
Coefficient of thermal expansion: 3.6ppm/°C (other options available: 2.8, 3.6, 4.0, 4.3, 5.3 ppm/°C, etc.)
